Thermal grease GD900 heat sink compound paste silicone 30 gram
- GD900 Silicone thermal grease paste
- High temperature and water resistance
- High effective and reliable to use
- Operation Temperature : -50~200°C
- Thermal Conductivity : > 4.8 w/m-k
- Specific Gravity: > 2.3 g/cm3
- Material: silicone
- Weight: 30g
- Uses: CPU, graphics card, and other hot chips.
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Normally shipped within 24-48 hours
14 days return policy
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Product Overview:
The GD900 Silicone Thermal Grease Paste is a high-performance thermal interface material designed to enhance heat dissipation in electronic components. It is particularly effective for CPUs, graphics cards, and other heat-intensive chips, ensuring reliable operation and longevity.Key Features:
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High Temperature Resistance: Operates effectively within a temperature range of -50°C to 200°C, making it suitable for demanding applications.
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Water Resistance: Offers protection against moisture, ensuring consistent performance in various environments.
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Thermal Conductivity: Features a thermal conductivity of greater than 4.8 W/m-K, providing efficient heat transfer and reducing component temperatures.
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Specific Gravity: Has a specific gravity of greater than 2.3 g/cm³, indicating a dense and effective thermal compound.
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Material: Made from silicone, ensuring durability and stability over time.
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Weight: Available in a convenient 30g package, suitable for multiple applications.
Benefits:
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Enhanced Heat Dissipation: Reduces thermal stress on components, improving their lifespan and performance.
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Reliability: Provides consistent and reliable thermal conductivity, even in extreme temperatures.
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Versatility: Suitable for a variety of electronic components, including CPUs and graphics cards.
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